Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.
下列因素是必须被考虑的：包括合金的类型、锡粉的粒径大小以及助焊剂的类型。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid - sulfonic acid type tin stripper.
以硝酸-磺酸型退锡剂为基础配方，研制了一种脱除废旧电路板表面残留焊锡的剥离液。
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