• Factors, which must be taken into consideration, include the type of alloy, the size of the solder powder and the type of flux.

    下列因素是必须被考虑的:包括合金的类型、锡粉的粒径大小以及助焊剂的类型。

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  • This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.

    概述了低熔点和高熔点型无铅焊膏的开发动向。

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  • A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid - sulfonic acid type tin stripper.

    以硝酸-磺酸型退锡剂为基础配方,研制了一种脱除废旧电路板表面残留焊锡的剥离液。

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  • The structure, type, test and the advantage of the brass solder in te grated air board are also put forward.

    介绍了钎焊集成气路板的结构、型式与出厂试验项目的选取以及应用优势。

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  • A new type of solder was fabricated by adding microelements into tin-bismuth series solder and then being rapid cooled.

    在锡铋系焊料中加入微量元素,通过快速冷却制成新的焊料,并对其组织与性能进行了研究。

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  • The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.

    本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。

    youdao

  • The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.

    本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。

    youdao

  • The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.

    本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。

    youdao

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