The paper discusses the SMT process of solder paste printing for electronic product with high throughput and high-quality.
讨论了电子产品s MT制造过程中如何在产品高质量的基础上实现锡膏印刷的高生产量。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
It specifies the influence of the parameters of solder paste printing, printing cycle, ease operation of software and additional steps of cleaning and inspection on improving the quality of products.
阐述了锡膏印刷工艺参数，印刷周期，操作软件的易用性，以及清洗、检验等附加工序对实际生产量的影响。
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