The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
应用推荐