The temperature at mold outlet, the flow rate of cooling water, the cooling distance, the melt temperature and the drawing speed were the major factors determined the process of the single crystal copper continuous casting.
确定结晶器出口温度、冷却水量、冷却距离、熔体温度、拉坯速度为铜单晶连铸实验的主要影响因素。
参考来源 - 铜单晶连铸工艺研究·2,447,543篇论文数据，部分数据来源于NoteExpress
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
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