This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
从目前的研究中，它被发现，单晶铜线材可以键合金垫和铝焊盘上由无气体保护的热超声球焊和楔焊。
The dislocation etch pits density(EPD) of copper single wires is related with corroded time, deformative extent and crystal orientation of material.
铜单晶线材中位错蚀坑密度与材料浸蚀时间，变形量以及晶体学取向有关。
On the basis of fundamental nanoindentation theory, nanoindentation of single-crystal copper has been researched.
基于纳米压痕理论方法，对单晶铜进行了纳米压痕试验。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
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