This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。
Laser is used as active light source for the first time in photoeleotrochemioal image deposition on P-type silicon substrate, and pictures with clear structures are obtained.
本文首次用激光作激励光源，在P型硅片上成功地进行了光电化学成像沉积，得到层次清晰的图像。
The advanced system based on the amorphous silicon detector was applied to acquire rich original image.
采用先进的非晶硅数字检测系统获取信息丰富的原始图像，叠加曝光降低图像噪声；
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