• This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital image Processing and Pattern Recognition.

    介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

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  • Laser is used as active light source for the first time in photoeleotrochemioal image deposition on P-type silicon substrate, and pictures with clear structures are obtained.

    本文首次用激光作激励光源,在P型硅片上成功地进行了光电化学成像沉积,得到层次清晰的图像。

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  • The advanced system based on the amorphous silicon detector was applied to acquire rich original image.

    采用先进的非晶硅数字检测系统获取信息丰富的原始图像,叠加曝光降低图像噪声;

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  • Effect of inclusions on mechanical properties of the high silicon cast steel was experimentally studied by using image analysis method.

    本文利用图像分析技术,系统研究了非金属夹杂物对等温淬火高硅铸钢力学性能的影响。

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  • Since these good results are obtained from the films on silicon, it is therefore of significance for monolithic integrated infrared image sensors.

    这些较好的实验结果是在硅基衬底上的铁电薄膜中获得的,因而对研制单片集成的红外热释电阵列将有一定的意义。

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  • Since these good results are obtained from the films on silicon, it is therefore of significance for monolithic integrated infrared image sensors.

    这些较好的实验结果是在硅基衬底上的铁电薄膜中获得的,因而对研制单片集成的红外热释电阵列将有一定的意义。

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