The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
The Trend of IDM Outsource and Opportunities for China Semiconductor Packaging & Testing Companies .
传统的 IDM 外包趋势与中国半导体封装产业的机遇?。
Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability.
树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。
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