The snap curing oven is key equipment in the semiconductor packaging.

半导体封装快速养护炉是半导体封装过程中的一个关键设备。

youdao

Semiconductor packaging; Fuzzy Analytic Hierarchy Process (FAHP); Fuzzy Analytic Network Process (FANP); Supplier; Decision analysis.

半导体封装； 模糊分析层级程序法； 模糊分析网路程序法； 供应商； 决策分析。

youdao

Its products are routinely used in applications demanding highly precise, controlled movement including: robotics, medical, assembly, semiconductor, packaging, engraving and pick-and-place.

其产品广泛用于需要高精度、运转控制的应用中，包括：机器人、医学、组装、半导体、包装、雕刻和分拣。

youdao

Outside of Singapore, regional tech companies are mostly final-assembly contractors and semiconductor packaging companies.

CNN: Money & Investing

The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

FORBES: Don't Turn My Company Into A Patent Troll!

It is home to the world's No. 2 and No. 3 chip-packaging and chip-testing companies, Advanced Semiconductor Engineering (ASE) and Siliconware Precision (SPIL) .

FORBES: Cisco kidding?