The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
Semiconductor packaging; Fuzzy Analytic Hierarchy Process (FAHP); Fuzzy Analytic Network Process (FANP); Supplier; Decision analysis.
半导体封装；模糊分析层级程序法； 模糊分析网路程序法；供应商；决策分析。
Its products are routinely used in applications demanding highly precise, controlled movement including: robotics, medical, assembly, semiconductor, packaging, engraving and pick-and-place.
其产品广泛用于需要高精度、运转控制的应用中，包括：机器人、医学、组装、半导体、包装、雕刻和分拣。
Its products are routinely used in applications demanding highly precise, controlled movement including: robotics, medical, assembly, semiconductor, packaging, engraving and pick-and-place.
其产品广泛用于需要高精度、运转控制的应用中，包括：机器人、医学、组装、半导体、包装、雕刻和分拣。
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