Analysis of magnesium alloy chemical bath main salt,reducing agent concentration,pH value,agent for the plating rate impact.
分析镁合金化学镀液的主盐、还原剂浓度、pH值、络合剂对镀速的影响。
参考来源 - 镁合金高耐蚀性组合镀层的制备与机理研究The concentration of zinc ion reduces plating rate and the deposits hardness; weaken the corrosion resistance of deposits.
锌离子浓度增加降低了镀速和镀层硬度,减弱了镀层的耐蚀性。
参考来源 - 电沉积Fe·2,447,543篇论文数据，部分数据来源于NoteExpress
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
The effects of plating conditions on the plating rate, the deposit composition, and the magnetic properties of the deposit were studied.
研究了沉积条件对沉积速率、镀层组成和磁性能的影响。
The chemical Ni P plating mechanism in acid baths and the major aspects which influence the plating rate and P content of Ni P alloy coatings were discussed.
从镍磷化学镀的反应机理出发，讨论了反应中影响磷沉积速率和镀层中磷含量的主要因素，试验制备了含磷量较高且抗蚀性良好的镍磷镀层。
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