• The effects of plating conditions on the plating rate, the deposit composition, and the magnetic properties of the deposit were studied.

    研究了沉积条件对沉积速率、镀层组成和磁性能的影响。

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  • The chemical Ni P plating mechanism in acid baths and the major aspects which influence the plating rate and P content of Ni P alloy coatings were discussed.

    从镍磷化学镀的反应机理出发,讨论了反应中影响磷沉积速率和镀层中磷含量的主要因素,试验制备了含磷量较高且抗蚀性良好的镍磷镀层。

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  • Experimental results indicate that compare to single stabilizing agent, compound stabilizing agent has higher plating rate, better stability and lower porosity.

    结果表明:复合稳定剂比单一稳定剂镀速高、稳定性好、孔隙率低。

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  • Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.

    硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点,在电镀生产中已广泛应用。

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  • The stabilizers can improve the stability of the bath. The dose of the stabilizers is determined by studying the mixed potential-time curves and the impact of stabilizing time on the plating rate.

    稳定剂提高了镀液的稳定性,通过混合电位-时间曲线的研究和其对镀液稳定时间和镀速的影响,确定了稳定剂的加入量。

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  • Besides, deposition rate of electroless tin also increases with increasing plating time.

    若继续升高镀液温度,沉积速率却降低。

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  • The microstructure, composition of plating, microhardness, deposited rate and so on were discussed.

    分别对镀层组织、镀层成分、显微硬度和沉积速率进行了讨论。

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  • Imports of technology of vacuum plating, guarantee under the continuous high temperature electroplated layer, reflecting lower rate does not appear to ensure that bright 3-5 years as new.

    进口工艺真空电镀,保证电镀层在持续高温下,反光率不降低,确保3 - 5年光亮如新。

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  • The optimized immersion gold plating bath contains an organic additive which can slow down initiatory deposition rate, result in a slow dissolution of Ni-P substrate.

    此工艺含有能够减缓镀金初始时沉积速率,又能降低对镍层腐蚀的添加剂。

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  • An electroless nickel plating process with high deposition rate was optimized by orthogonal test.

    通过正交试验法优选出一种具有高磷含量的快速化学镀镍工艺配方。

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  • The effects of operation conditions on the rate of deposition are studied and the optimum plating process is defined.

    研究了操作条件对沉积速度的影响,确定了最佳工艺条件。

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  • On the base of the technology of electroless Ni plating on PET fabric, the electromagnetic shielding dacron fabric of different increasing weight rate was developed.

    基于织物 化学镀技术,开发出不同增重率的 化学镀镍电磁屏蔽涤纶织物。

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  • The rate capability of the alloys is improved after plating, due to the fine particles formed through hydrogen crisping and the nickel layer contributed to the conductivity of electrodes.

    镀镍层有利于贮氢合金氢化物电极大电流放电,这种作用源于微包覆过程中氢脆引起合金颗粒的细化与表面镀层增强了电极的导电性。

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  • Practices show that the treatments before plating is the key to electroplating process. According to the technological specification, the qualified rate of better ele...

    应用实践表明,镀前处理是电镀过程中的关键,按照工艺规程表操作,电镀件良好的合格率是可以达到的。

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  • Practices show that the treatments before plating is the key to electroplating process. According to the technological specification, the qualified rate of better ele...

    应用实践表明,镀前处理是电镀过程中的关键,按照工艺规程表操作,电镀件良好的合格率是可以达到的。

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