Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
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