Bonding pad 焊盘 ; 打线垫
chip bonding pad 芯片焊盘
The Bonding Pad 压焊脚
Bonding pad design 焊盘技术 ; 焊盘设计
bonding g pad 焊盘 ; 键合点
bonding pad area 及一接合区域
chellop bonding pad 芯片焊盘
We are used is the import assembly glue can reached 750 degrees, and the brake pad bonding surface more than 80%.
我们使用的是进口的粘结胶可以达到750度，并且刹车片粘结面超过80%从而排除由于刹车片粘结不够而造成脱落。
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数——焊盘间距也不断缩小以满足市场要求。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
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