Further, it USES Dual Chip Modules (DCMs) and Multi-Chip Modules (MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.
此外，它还分别使用双芯片模块(DCM)和多芯片模块(MCM)作为其中端服务器和高端服务器的基本构建块。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.
本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。
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