Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;
研究了玻璃粉／环氧树脂封接复合材料的制备与性能。
The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.
本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。
In this paper, molding process for low-pressure sheet molding compounds thickened by crystalline unsaturated polyester was investigated.
对结晶不饱和树脂增稠聚酯模塑料的中温低压模压成型工艺进行了研究。
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