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mold compound

  • 模压胶料:一种用于电子元器件封装的材料,通常由树脂、填料和固化剂组成。

网络释义

短语

alkyd molding compounds 醇酸模塑料

bulk molding compounds 整体模塑料

thermosetting molding compounds 热固模制配料

sheet molding compounds 全张模制化物 ; 全张成型

EPOXY MOLDING COMPOUNDS 材料 ; 环氧模塑料

Phenolic molding compounds 酚醛模制化合物

Epoxy Sheet Molding Compounds 环氧片状模塑料

silicone molding compounds 有机硅模塑料

epoxy molding compounds for semiconductors 半导体用环氧模塑料

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双语例句

  • The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.

    本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。

    youdao

  • In this paper, molding process for low-pressure sheet molding compounds thickened by crystalline unsaturated polyester was investigated.

    对结晶不饱和树脂增稠聚酯模塑料的中温低压模压成型工艺进行了研究。

    youdao

  • In this paper, the preparation, structures and properties of phenolic molding compounds reinforced with sisal fiber (SF) and sisal-glass (GF) hybrid fibers were studied systematically.

    本文研究了剑麻纤维(SF)及剑麻-玻纤(GF)混杂纤维增强酚醛模塑料的制备工艺、结构形态及性能。

    youdao

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