The epoxy molding compounds (EMC) was prepared by hot pressing molding method.

采用热模压法制备了环氧模塑料（EMC）。

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The recent research and development of the high performance epoxy molding compounds are summarized in the present paper.

本文综述了近年来国内外在高性能环氧树脂电子封装材料方面的研究与进展情况。

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Study on Latent Curing Agent of Epoxy Resin Sheeting Molding Compounds;

研究了玻璃粉／环氧树脂封接复合材料的制备与性能。

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