Series E14 incorporates the latest in microelectronic packaging, LED light sources, and matched sensors.
系列E14采用了最新的微电子封装，LED光源，及配套传感器。
In the microelectronic packaging, the reliability of the solder joint has been being a forward position and a hot topic.
电子封装中的的焊点可靠性问题一直是电子封装中学科的前沿和热点问题。
So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。
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