The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。
It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
Series E14 incorporates the latest in microelectronic packaging, LED light sources, and matched sensors.
系列E14采用了最新的微电子封装，LED光源，及配套传感器。
LTCC is the important composite of modern microelectronic packaging. The perfect properties make it useful widely in the high-speed and high-frequency system.
LTCC是现代微电子封装中的重要组成部分，因性能优良而广泛应用于高速、高频系统。
With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。
应用推荐