Finally, strategies for improving the performance of the heat sink are presented. Different dimensions and heat load requirements are proposed for different microchannel heat sink applications.
对于不同应用的微通道热沉,有不同的空间尺寸和热负荷要求,本文针对微通道热沉内流体流动与传热的特点设计了优化算法,编制了优化设计软件。
参考来源 - 微通道热沉内流体流动与传热的数值模拟The structure of V-shaped microchannel heat sink is extremely complex and irregular.
Ⅴ型微通道热沉结构复杂，是一个不规则体，所以对其进行理论分析时，遇到很多困难。
参考来源 - V型微通道热沉的流体流动与传热问题研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Due to its outstanding heat transfer capacity and compact structure, the microchannel heat sink is the best choice for cooling of high-power electron device with small volume.
微管道换热器以其换热性能卓越、结构紧凑等优点成为小体积高功率电子器件首选的新型散热方式。
应用推荐