Microchannel heat sink is a promising technique to dissipate high heat flux microelectronic chips in the near future.
微通道热沉是解决高热流密度微电子芯片散热的一种有效途径。
Due to its outstanding heat transfer capacity and compact structure, the microchannel heat sink is the best choice for cooling of high-power electron device with small volume.
微管道换热器以其换热性能卓越、结构紧凑等优点成为小体积高功率电子器件首选的新型散热方式。
Due to its outstanding heat transfer capacity and compact structure, the microchannel heat sink is the best choice for cooling of high-power electron device with small volume.
微管道换热器以其换热性能卓越、结构紧凑等优点成为小体积高功率电子器件首选的新型散热方式。
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