In chapter 2, the breaking strength of the crystalline silicon was studied through the micro force-displacement balance.
第二章讲述了单晶硅的破坏强度问题，并用微力微位移天平方法进行研究。
The automatic assembly system consists of a micro force sensor integrated micromanipulator, a bonding centre with three working cells, and a microscopic vision module.
在此基础上确定了自动组装系统的组成结构，并详细介绍了研制的具有力感知功能的微操作手、三工位键合炉以及显微视觉等关键技术模块。
Then the techniques about actuators, micro displacement sensors, and micro force sensors were discussed and compared respectively as they were main parts in microscale mechanics testing.
阐述了微构件力学性能的研究现状与存在的力学性能参数表征问题，而后重点介绍了微构件力学性能测试中相关的驱动方式、微位移检测和微力检测技术。
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