micro package 微封装
micro-package technique 微组装技术
Micro Lead Package 微引线封装
micro-module package 微型封装件
micro-ceramic package 微小型陶瓷封装
micro-electronic package 微电子封装
micro-electrical system package 微电子系统封装
According to package characteristics of long linear HgCdTe IRFPA detector, difficulties of the metal split micro dewar manufacture are discussed in the paper.
针对长线列碲镉汞红外焦平面探测器封装的特点，文章讨论了分置式微型杜瓦研制的难点。
A novel micro-optical crossover interconnection package has been proposed.
提出了一种新颖的自由空间微光学互连模块。
Therefore, research on temperature distribution and thermal stress of micro-electronic package is very important, which has both theoretical and practical significance.
因此，对微电子封装器件的温度分布以及热应力进行研究就显得十分重要，具有重要的理论和实际意义。
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