Chemical Mechanical Polish 化学机械研磨 ; 化学机械抛光
chemical-mechanical polish 化学坏抛光法一种去掉圆片表面某种物质的方法
oxidative mechanical polish 氧化机械抛光
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
The outer sheath of cables has high mechanical strength, good abrasion resistant and high polish degree.
电缆外护套机械强度高、耐磨性好，并且具有高光洁度。
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