• Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.

    化学-机械抛光(CMP) -平整抛光圆片工艺采用化学移除和机械抛光两种方式。此工艺前道工艺使用

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  • Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.

    化学-机械抛光(CMP) -平整抛光圆片工艺采用化学移除和机械抛光两种方式。此工艺前道工艺使用

    youdao

  • The outer sheath of cables has high mechanical strength, good abrasion resistant and high polish degree.

    电缆机械强度耐磨性好,并且具有高光洁度。

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  • The application of this method makes the polish efficiency several-dozen times higher than that of the conventional manual-mechanical one and, at the same time, makes the quality of...

    应用该法使抛光效率传统手工机械方法提高几十以上,产品质量有大幅度提高。

    youdao

  • The application of this method makes the polish efficiency several-dozen times higher than that of the conventional manual-mechanical one and, at the same time, makes the quality of...

    应用该法使抛光效率传统手工机械方法提高几十以上,产品质量有大幅度提高。

    youdao

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