In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
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