Wafer Level Packaging 晶圆级封装技术 ; 晶片级封装
box level packaging [计] 机箱级组装
Fan-Out Wafer Level Packaging 扇出型晶圆级封装
Chip Level Packaging [电子] 片级组装
packaging level 包装等级 ; 封装等级 ; [电子] 组装级
wafer-level packaging 晶圆级封装
system level packaging 系统级封装
Wafer Level Chip Size Packaging 晶圆级芯片尺寸封装
Wire bonding is still the most popular interconnect technology in the first-level packaging.
一级封装中最流行的互连技术仍为丝焊。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
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