Wafer Level Packaging 晶圆级封装技术 ; 晶片级封装
box level packaging [计] 机箱级组装
Fan-Out Wafer Level Packaging 扇出型晶圆级封装
Chip Level Packaging [电子] 片级组装
packaging level 包装等级 ; 封装等级 ; [电子] 组装级
wafer-level packaging 晶圆级封装
system level packaging 系统级封装
Wafer Level Chip Size Packaging 晶圆级芯片尺寸封装
Wire bonding is still the most popular interconnect technology in the first-level packaging.
一级封装中最流行的互连技术仍为丝焊。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
文章论述了超csptm圆片级封装技术工艺。
The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
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