tin-lead plating 镀锡铅 ; 电镀铅锡
tin lead plating 镀锡铅合金
electroless lead plating bath 化学镀铅
lead-tin alloy plating 镀铅锡合金
lead-tin alloys plating 电镀铅锡合金
After plating with heating except with 1% of the internal stress or plating of sedimentary can avoid this lead a characteristics.
电镀后用加热法除内应力或电镀时与1%的铅共沉积可避免这一特性。
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金,用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
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