After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金，用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
Lead is also a common constituent of plating wastes, although not so frequently encountered as copper, zinc, cadmium and chromiurn .
尽管铅不如铜、锌、镉和铭那样常见，但它却是电镀废水中的普通组分。
No practicable substitutes for lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body are available.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅的替代品仍然不切实际。
Through-thickness cracking also can lead to fatigue or stress corrosion cracking of the base metal beneath the plating.
还会形成穿透型裂纹，造成镀层下本体金属的疲劳或应力腐蚀裂纹。
Especially in, high-end radiator electroplating, in acid, nickel plated copper plating nickel etc, black has a wealth of experience in production practice, plating industry area is the lead.
尤其在中、高端散热器电镀方面，在酸性镀铜、镀镍、黑镍等有着丰富的生产实践经验，在电镀行业领域具有领先地位。
All to ROHS standard, plating line with general international environmental protection standards, the lead, cadmium, mercury, hexavalent chromium not to exceed bid.
所有镀种符合ROHS标准，符合国际通用环保标准，铅、镉、汞、六价铬不超标。
All the ROHS standards, in conformity with the plating line with general international environmental standards, lead, cadmium, mercury, hexavalent chromium not to exceed bid.
所有镀种符合ROHS标准，符合国际通用环保标准，铅、镉、汞、六价铬不超标。
The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important.
引线框架电镀层的质量直接影响着钽电容器的可焊性，所以引线框架电镀层质量的测定方法至关重要。
The lead concentration in Pb-Sn alloy plating bath was determined by standard additional atomic ab-sorption spectrometry, and the optimal determination conditions were obtained.
采用标准加入原子吸收分光光度法测定铅锡合金锭液中铅的浓度，试验确定了最佳的测定条件。
A kind of lead-dioxide electrode was prepared by plating lead dioxide on the surface of kryptol.
其中二氧化铅电极是通过在碳棒上电镀而成的。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
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