论文阐述了PC接插件产业中主要焊接方式:手工焊接,热风焊接(Hot air),热棒焊接(Hot bar)和激光焊接(Laser solder)等及其应用特点。在激烈的产业竞争中,各接插件厂商为了提高产品质量,都在积极的优化或提高自动焊接方式。
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Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
A semiconductor laser array with pulse power of 100w was made by utilizing the solder.
利用这种焊料研制出脉冲功率达100w的半导体激光器列阵。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
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