Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
A semiconductor laser array with pulse power of 100w was made by utilizing the solder.
利用这种焊料研制出脉冲功率达100w的半导体激光器列阵。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
Utilizing this kind of solder, we have assembled laser arrays with single-bar pulse power of 100W and stacks with pulse power of 600W each.
利用这种结构的焊料，我们成功地组装出单条无铝线阵脉冲功率100W的线阵，无铝叠阵脉冲功率为600W。
The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads.
实验通过选择性地对涂敷在CCL基板上的钎料进行激光加热并熔化，最后形成焊料凸点矩阵。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
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