stealth laser dicing 隐形激光划片
Laser Dicing Machine 激光划片机
water jet guided laser dicing 微水刀激光划片
laser r dicing 激光切片
Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
The higher speed of dicing has led to a productivity increase of 5 – 8 times, compared with any other conventional separation system, 3- 5 times any other laser dicing concept.
较高的刻线速度提高了产能，与其他常规方式大概提高了5-8倍，与其他激光方式提高了3-5倍。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
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