Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
The higher speed of dicing has led to a productivity increase of 5 – 8 times, compared with any other conventional separation system, 3- 5 times any other laser dicing concept.
较高的刻线速度提高了产能，与其他常规方式大概提高了5-8倍，与其他激光方式提高了3-5倍。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
Normally as a result, material removal rates and therefore dicing speed is lowered and the laser capability with respect to the available power is far from optimized.
通常情况下，剥离速度和切割速度都是很低的。基于其本身的能力来讲，激光器没有运行在最优化的状态下。
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