ic process technology 集成电路工艺学
IC Process Lab 集成电路工艺实验室
thin-film IC process 薄膜集成电路工艺
ic process and product test 特性评价试验
deep submicron ic process 深亚微米ic工艺
and ic process ic工艺
film IC process 薄膜集成电路工艺
thin film IC process 薄膜集成电路处理
IC process compatibility 集成电路工艺兼容
With the development of IC process technology, the impact of interconnects on the design of IC's is becoming greater.
随着集成电路生产工艺的进展，互连线在集成电路设计中的影响越来越大。
The laminated material is an advanced compound material. A new vibratile drilling technology with step type variable parameter is suitable IC process the new laminated material.
叠层材料是一种先进的复合材料，阶跃式变参数振动钻削新工艺最适合于加工新型叠层材料。
The invention belongs to the field of micro electronic technique, concretely relating to a high performance stacked differential symmetrical inductance designed by standard IC process piece.
本发明属于微电子技术领域，具体涉及一种用标准集成电路工艺片设计的高性能叠层结构差分驱动的对称电感。
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