With the development of IC process technology, the impact of interconnects on the design of IC's is becoming greater.
随着集成电路生产工艺的进展，互连线在集成电路设计中的影响越来越大。
The laminated material is an advanced compound material. A new vibratile drilling technology with step type variable parameter is suitable IC process the new laminated material.
叠层材料是一种先进的复合材料，阶跃式变参数振动钻削新工艺最适合于加工新型叠层材料。
The invention belongs to the field of micro electronic technique, concretely relating to a high performance stacked differential symmetrical inductance designed by standard IC process piece.
本发明属于微电子技术领域，具体涉及一种用标准集成电路工艺片设计的高性能叠层结构差分驱动的对称电感。
This video log amplifier is based on a monolithic IC, which is fabricated using PN junction isolation bipolar process by SISC, and all peripheral devices are integrated using hybrid IC process.
该视频对数放大器是在自制单片ic基础上混合集成，单片IC采用PN结隔离双极工艺制作。
It is one of main use of process simulation with SUPREM to gain semiconductor IC process conditions, This paper will introduce how to gain automatically IC process conditions in the proper algorithm.
利用SUPREM进行半导体集成电路工艺条件的萃取是工艺模拟的主要用途之一。本文介绍如何利用适当的算法进行工艺条件的自动萃取。
The distortion in pattern transferring process may influence functionality and performance of IC products and lower the production yield.
版图图像转移过程的失真，将影响产品的性能参数，直接降低了集成电路的成品率。
This paper provided the application of simulating human intelligent control multi-mode IC control to the starting process of the electronic magnetic controlled gyrocompass.
本文提出将多模态仿人智能控制应用于陀螺罗经的启动过程。
In deep submicron era, IC design in physical design has more and more challenge, with the increasing design scale, faster clock frequency and minimizing process dimension.
在深亚微米时代，随着设计规模变大，时钟频率越来越高以及工艺尺寸的减小，IC物理设计面临着诸多困难。
In the manufacture process of integrated circuit (IC), lithography occupy a very important step, and the quality of photomask used in lithography affects the yield of LSI.
光刻是大规模集成电路生产流程中十分关键的一环，而光刻中使用的掩模的质量对大规模集成电路的成品率有很大的影响。
Different CVD thin films are compared and their corresponding applications in the back-end process of IC manufacturing are summarized.
对不同种类的CVD薄膜进行了比较和分析，并主要讨论了CVD绝缘介质薄膜在后段工艺中的应用。
This paper briefly introduces the theory of intelligent card, and then discusses the application of fiscal IC card in the process of tax control.
简要介绍了智能卡(IC)原理，并对税控IC卡在税控流程中的应用进行了研究。
Experimental result shows that the performance of encapsulation adhesive tape trial-manufactured meets the demand of encapsulating quality and process of IC card.
实验结果表明，试制的封装胶带满足IC卡封装质量与工艺要求。
At last, the paper pointed out that the problems should be paid attention to during the process of constructing IC.
最后，指出在具体IC实施过程中应该注意的问题。
An ESD protection circuit for IC CARDS is described, which is based on CMOS process.
介绍了ESD保护结构的基本原理，并提出一个基于CMOS工艺用于IC卡芯片的保护电路。
On this basis it makes some study on the combustion process of hydrogen-fueled IC engine by changing the ignition advance angle and equivalence ratio of the model.
在此基础上，进行了点火提前角和燃空当量比对氢内燃机燃烧过程的影响研究，为合理组织氢内燃机的燃烧过程研究提供了依据。
IC with multi-lead and small-pitch is difficult to detect and locate in electronic product manufacturing process.
多引脚小间距IC器件是电子产品生产过程中视觉检测与定位的难点。
The working principle and design method of one phase power meter with IC card is presented. Hardware circuit is given and its working process is discussed.
给出了单相IC卡电度表的工作原理、设计方法和硬件电路并讨论了其工作过程，同时给出了程序的主要工作过程流程图和设计思想。
The micro gas pressure sensor designed in this thesis can be fabricated using an IC compatible process, and it is composed of a heating resistor, a sensitive element and a testing resistor.
本文设计的微气压传感器的制作工艺与集成电路工艺兼容，结构上主要包括加热电阻、敏感元件和测试电阻等三部分。
This thesis analyzed the current researching situation, introduced process variations and the influence to IC devices, interconnect and circuits.
论文分析了当前的研究状况，介绍了集成电路工艺变异的内容及对集成电路器件、互连以及电路性能的影响。
A very brief summary of the process of IC test and the technology of IC test in this paper. Also the automate test system is introduced in the paper.
该文从集成电路测试的过程概述性地介绍了集成电路的测试技术和集成电路的自动测试系统。
The significance of this article is to propose an effective semi-conductor IC manufacturing process that provides vertical NPN, vertical PNP and lateral PNP transistors.
本研究对生产实际的指导意义在于，有效的提供了一种半导体集成电路制造工艺，能够同时提供纵向NPN晶体管，纵向PN P晶体管以及横向PN P晶体管。
A real time statistical analysis methodology of IC manufacturing process in combination with an experimental design is presented.
与试验设计方法相结合，提出了一个用于集成电路工艺实时统计分析的方法。
As the IC feature size continues to decrease, interconnect cross-talk noise with the process fluctuation is also a corresponding increase in sensitivity.
随着集成电路特征尺寸的不断减小，互连线的串扰噪声对工艺波动的灵敏度也在相应增加。
The Schottky diode and the method of making same same can meet the requirements of metal-oxide-semiconductor process and be suitable for integrated production of sub-micro IC also.
该肖特基二极管及其制造方法能够满足金属氧化物半导体工艺的需求，并适用于亚微米集成电路的集成生产。
So the impact of process fluctuations on performance has become extremely critical in IC design.
因此在集成电路设计中，互连工艺波动对集成电路性能的影响变得至关重要。
The stochastic nature of the IC fabrication process and the resulting difficulties in the process control are described.
本文说明了IC生产工艺的随机性及其给工艺控制和决策带来的困难。
Furthermore, there has to be a tie between IC design and process design.
更重要的是，在IC设计和工艺流程设计之间还存在着一个纽带。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
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