It is discusses the effect way to improve high power LED packaging technology, from dice selection, improve thermal management and how to select silicon Gel.
从芯片选择、改善热处理工艺以及如何选择硅胶等几个方面入手，本文讨论了如何有效地提高功率型LED封装工艺。
A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
High power LED Lamp is characterized by small volume, light weight, epoxy resin packaging, good impact resistance and unbreakable property.
大功率LED灯体积小、重量轻，环氧树脂封装，可承受高强度机械冲击和震动，不易破碎。
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