A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
High power LED Lamp is characterized by small volume, light weight, epoxy resin packaging, good impact resistance and unbreakable property.
大功率LED灯体积小、重量轻，环氧树脂封装，可承受高强度机械冲击和震动，不易破碎。
Products include metal packaging shell, seal connectors, lithium battery cover group, sensor, a high power LED lamp sintering stent 5 old series such as several varieties.
产品包括金属封装外壳、密封连接器、锂电池盖组、传感器烧结座、大功率LED灯支架等五大系列十几个品种。
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