It is discusses the effect way to improve high power LED packaging technology, from dice selection, improve thermal management and how to select silicon Gel.
从芯片选择、改善热处理工艺以及如何选择硅胶等几个方面入手，本文讨论了如何有效地提高功率型LED封装工艺。
A packaging structure of high-power LED was presented, microlens array was employed in the secondary optical design, optical properties of the package was studied using Trace pro.
建立了一种大功率LED的封装结构，二次光学设计采用了微透镜阵列技术，运用光线追踪法研究了这种封装结构的光学性能。
High power LED Lamp is characterized by small volume, light weight, epoxy resin packaging, good impact resistance and unbreakable property.
大功率LED灯体积小、重量轻，环氧树脂封装，可承受高强度机械冲击和震动，不易破碎。
Products include metal packaging shell, seal connectors, lithium battery cover group, sensor, a high power LED lamp sintering stent 5 old series such as several varieties.
产品包括金属封装外壳、密封连接器、锂电池盖组、传感器烧结座、大功率LED灯支架等五大系列十几个品种。
Two kinds of 1 W white high power light emitting diode (LED) were made by packaging blue chips from Taiwan and US. The chips were coated by the same phosphor and transparent silica gel.
制备了两种1W白光功率发光二极管（LED），这两种样品分别是对台湾和美国两家公司生产的蓝光芯片，涂敷相同荧光粉和透明硅胶封装而成。
Two kinds of 1 W white high power light emitting diode (LED) were made by packaging blue chips from Taiwan and US. The chips were coated by the same phosphor and transparent silica gel.
制备了两种1W白光功率发光二极管（LED），这两种样品分别是对台湾和美国两家公司生产的蓝光芯片，涂敷相同荧光粉和透明硅胶封装而成。
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