High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
The card is PCI add card, comprised with the core chip, a high density high capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.
该卡是以高密度高性能的FPGA芯片为核心，图像采集芯片、图像输出芯片、PCI桥芯片、DDR动态存储器等为辅助的PCI扩展卡。
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