High density packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
The card is PCI add card, comprised with the core chip, a high density high capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.
该卡是以高密度高性能的FPGA芯片为核心，图像采集芯片、图像输出芯片、PCI桥芯片、DDR动态存储器等为辅助的PCI扩展卡。
By giving an example which USES GAL to develop a binary ratio multiplier, the author explains in detail the method of using GAL chip to develop a high-density integrated circuit.
通过给出一个用通用阵列逻辑芯片GAL开发二进制比例乘法器的事例，详细介绍了用GAL芯片开发高集成度逻辑电路的方法。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
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