Therefore, plasma etching anisotropy can be improved by increasing rf frequency or rf-bias power.

因此，等离子体刻蚀的各向异性可以通过增加射频频率和射频功率来改善。

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This paper reported a silicon micromachined gyroscope that is driven by the rotating carrier's angular velocity. The silicon chip was manufactured by anisotropy etching.

报道了一种利用旋转体自身角速度作为驱动力，通过各向异性刻蚀硅片制作的硅微机械陀螺。

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Finally, by researching the mechanism of the anisotropy etching, the fabricating procedure of MOEMS optical switch array is designed.

最后，研究了各向异性腐蚀的机理，设计了MOEMS光开关阵列芯片的制作工艺。

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