The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.
介绍了晶纹镀锡中重熔工序的操作要点和安全要求。
应用推荐