... 无氰碱性锌电镀non-cyanide plating process 锡电镀tin plating process 线路板电镀printed circuit boards ...
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Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
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