All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。
Rotary cutting it to the chip or equal to the width of the linear cutting chip thickness.
它等于旋削中的切屑宽度或者等于线性切削中的切屑的厚度。
This control system developed by the core of single chip computer can anti-divide the thickness of the gland shim, It has good dividing precision and high sorting efficiency.
以单片机为核心开发的该控制系统能对缸盖垫片的厚度进行自动分选，从而保证了缸盖垫片的分选精度，提高了分选效率。
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