All calculations confirm that a compound thickness ratio of 1.2 results in minimal warpage for a large chip TSOP.
所有的计算结果证明化合物厚度比为1.2，会使大芯片TSOP的翘曲问题最小化。
Rotary cutting it to the chip or equal to the width of the linear cutting chip thickness.
它等于旋削中的切屑宽度或者等于线性切削中的切屑的厚度。
This control system developed by the core of single chip computer can anti-divide the thickness of the gland shim, It has good dividing precision and high sorting efficiency.
以单片机为核心开发的该控制系统能对缸盖垫片的厚度进行自动分选，从而保证了缸盖垫片的分选精度，提高了分选效率。
The three dimensional characteristic of cutter feed motion is considered in the formulation of undeformed radial chip thickness.
在径向未变形切屑厚度公式的推导中，考虑了刀具进给运动的三维特点。
The influence of depth of grinding, feed rate and circular linear speed of the grinding wheel on the grinding forces with respect to the maximum chip thickness of a single active diamond was analyzed.
从单颗金刚石最大切削厚度的角度，分析了磨削深度、进给速度和砂轮线速度对磨削力的影响。
The method comprises a step of removing a thin slice of the integrated circuit chip from part of the thickness along the direction vertical to the structure length.
所述方法包括以沿垂直于所述结构长度的方向的方式从所述厚度 的部分去除一所述集成电路芯片的薄片。
The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.
电极部分设置于在半导体芯片的厚度方向上与传感器元件不重叠的位置。
The feed point location of the SIS chip has little effect on the embedding impedance, while the chip thickness obviously does. These results will benefit the development of waveguide SIS mixers.
SIS结芯片馈点的位置对嵌入阻抗没有太大的影响，但芯片厚度的影响非常明显。这些结果对超导SIS混频器的研制有很好的指导意义。
It is found that the surface roughness influenced by wheel speed and grinding depth can be attributed to the changing of undeformed chip thickness.
研究发现：砂轮速度和磨削深度对表面粗糙度的影响都可归结为未变形切屑厚度的改变。
Residue stress in the ceramic chip of the composite tappet rod may be reduced by intermediate layer of soldered connection and by decreasing thickness of ceramic chip.
钎焊过渡层和减薄陶瓷块厚度可降低钎焊复合挺柱中陶瓷块的残余应力。
The calculation formula of the chip thickness was established under 3D cutting process and an uncontinuable adding up calculation algorithm of the chip thickness was proposed.
建立了三维切削下切屑厚度的数学表示，提出了递延累加切屑厚度计算算法。
The surface topography of the diamond grinding wheel and the undeformed chip thickness were measured by using a 3D surface profiler based on scanning white light interferometry.
提出了基于扫描白光干涉原理或移相干涉原理的三维表面轮廓仪对硅片延性域磨削是否实现进行评定的光学轮廓仪法。
The effects of wood chip thickness, presteaming, and surfactant application on impregnation degree were evaluated utilizing impregnation degree mathematical model.
在对木片成分进行合理划分和假设的基础上，建立了计算木片浸渍程度的数学模型。
The effects of wood chip thickness, presteaming, and surfactant application on impregnation degree were evaluated utilizing impregnation degree mathematical model.
在对木片成分进行合理划分和假设的基础上，建立了计算木片浸渍程度的数学模型。
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