DRY FILM & PATTERN PLATING 外层干膜与图形电镀
Strip Resist: The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork.
去膜:蚀刻后将抗蚀层干膜去除,得到所需的裸铜电路图图。
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.
显影:干膜上未被曝光的部分被显影药水溶解,于是在干膜面上出现沟槽,经过图形电镀将形成“图形”。
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