Strip Resist: The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork.

去膜：蚀刻后将抗蚀层干膜去除，得到所需的裸铜电路图图。

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Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.

显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。

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Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.

显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。

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