die bonding 芯片焊接 ; 晶粒接着 ; 模片键合 ; 片焊接
Die bonding and wire bonding 封装工艺工程师
die bonding jig 管心焊接模
adhesive die bonding 粘胶贴片
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It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
Inorganic bonding was suitable for assembly and fixing of small punch of rubber, plastic and stamping die.
氧化铜无机粘接适合于橡胶、塑料以及冷冲压模具小型芯小冲头的装配与固定。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
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