die bonding 芯片焊接 ; 晶粒接着 ; 模片键合
die bonding jig 管心焊接模
die and wire bonding 芯片导线焊接
die attach or chip bonding 芯片贴装
die mount bonding 小片装配接合
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It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
But it is not suit for precision dies, such as the folding and riveting die for the stators and rotators of motors. For precision dies, the method of bonding the guide bushes with glue is applicable.
但此方法用于精密模具(如电机定转子叠铆模)则有一定的弊端，用胶水粘接导套的方法可适用于精密模具。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
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