It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
But it is not suit for precision dies, such as the folding and riveting die for the stators and rotators of motors. For precision dies, the method of bonding the guide bushes with glue is applicable.
但此方法用于精密模具(如电机定转子叠铆模)则有一定的弊端，用胶水粘接导套的方法可适用于精密模具。
The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.
半导体封装粘结工艺养护过程要求炉内温度均匀分布，现有养护炉不能满足这一要求。
Through experiments with aluminous sheets, punch bonding mechanism and die designing are studied and main affecting factors on bonding strength characteristics are analyzed.
本文通过对铝板件进行冲压连接实验，研究了这种冲压连接技术的机理和冲压模具设计，并重点分析了影响连接强度特性的主要因素。
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.
根据这些曲线，说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。
应用推荐