copper-bath 硫酸铜溶液
acid electroplating copper bath 酸性镀铜溶液
copper sulfate bath 酸性镀铜液
Acid copper plating bath 酸性镀铜液
acidic copper plating bath 酸性镀铜液
copper from sulfate bath 硫酸盐镀铜
The process, technological parameters and equipments for producing W-Cu contact with isostatic pressure-sinter infiltration in copper bath were described.
本文叙述了冷等静压-烧结-液体浸铜工艺制取高密度高性能钨-铜触头的工艺过程、工艺参数控制及使用设备。
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金，用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
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