The process, technological parameters and equipments for producing W-Cu contact with isostatic pressure-sinter infiltration in copper bath were described.
本文叙述了冷等静压-烧结-液体浸铜工艺制取高密度高性能钨-铜触头的工艺过程、工艺参数控制及使用设备。
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).
研究了甲基异丁基酮(MIBK)萃取分离金，用电感耦合等离子体原子发射光谱法(ICP AES)测定镀金液中杂质元素的新方法。
The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.
硫酸盐光亮酸性镀铜，由于工艺的某些特殊性，对电镀设备要求很高。
The single potential method was adopted to study the electrocrystallization of Sb on the copper cathode from aqueous citric acid and potassium citrate bath.
采用电位阶跃法研究了铜基体上柠檬酸及其钾盐的缓冲溶液中锑的电结晶过程。
The absorption curves of the brightener UBAC 1a of bright acid copper plating and cupric sulfate of the bath were mensurated by experiments respectively.
通过实验分别测定了酸性镀铜光亮剂ubac1a和镀液中硫酸铜的吸收曲线。
Nickeltungsten alloy coating was deposited on copper plate making use of electroplating in the bath composed of nickel sulfate, sodium tungstate, and trisodium citrate.
采用硫酸镍、钨酸钠和柠檬酸三钠为基本组分的镀液，通过电镀的方法在紫铜试片上沉积得到了镍钨合金镀层。
The first layer encases the eternal surfaces of the metallic core and is produced by electroplating copper or copper alloy from a first bath containing copper ions.
第一层包覆所述金属芯的外表面，并且通过从包含铜离子的第一浴中电镀铜或铜合金产生。
Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.
在化学镀镍-磷合金液中加入硫酸铜制得镍-铜-磷三元合金。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
Effects of time, order of adding reagents, contents of ethanediol, silver nitrate, acid copper plating bath and nitrate on scattering intensity of resonance light were studied.
讨论了乙二醇用量、硝酸银用量、酸性镀铜液(底液)用量、硝酸用量、时间及试剂加入顺序对共振光散射强度的影响。
An analytical procedure and calculation method on the content of copper, total pyrophosphate, phosphate and ammonium citrate in pyrophosphate copper plating bath were given.
介绍了一种焦磷酸盐镀铜溶液中铜、总焦磷酸根、磷酸根、柠檬酸铵含量的分析方法和计算方法。
Behaviors of copper in blackening bath without selenium were studied.
对铜在无硒电化学发黑液中的行为进行了研究。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
This paper describes the technical features of oxygen bottom-blown bath smelting of copper, the effect in refractory gold concentrates treating, and the application in Vietnam, Dongying, Muping.
介绍了底吹熔池炼铜技术的特点、处理复杂金精矿的效果以及在越南、东营、牟平的应用情况。
Using the wasted cyanic copper-plating bath and electrolytic tank of new type designed by ourselves, to approach varieties of factors influencing upon the effect of de-cyaniding.
讨论了电解法处理含氰废水的原理，利用实际含氰镀铜废液和自行设计的新型电解槽，探讨了各种因素对脱氰效果的影响。
A new technology that the tin-nickel-copper alloy deposition can be electroplated in the citrate acid system bath was introduced.
研究了一种柠檬酸盐体系电镀锡镍铜合金新工艺。
This paper describes the fluid-dynamic phenomena of the slag and matte in bath of an electro-ore-thermal smelter for copper and nickel smelting.
讨论了铜、镍熔炼矿热电炉熔池内渣与铳的流体动力现象。
This paper describes the fluid-dynamic phenomena of the slag and matte in bath of an electro-ore-thermal smelter for copper and nickel smelting.
讨论了铜、镍熔炼矿热电炉熔池内渣与铳的流体动力现象。
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